Bacelli, G and Ringwood, J.V.
Tracking plasma etch process variations using Principal Component Analysis of OES data.
In: ICINCO 2007, 4th International Conference on Information in Control, Automation and Robotics, 9 - 12 May, 2007, Angers, France.
This paper explores the application of principal component analysis (PCA) to the monitoring of within-lot
and between-lot plasma variations that occur in a plasma etching chamber used in semiconductor
manufacturing, as observed through Optical Emission Spectroscopy (OES) analysis of the chamber exhaust.
Using PCA, patterns that are difficult to identify in the 2048-dimension OES data are condensed into a
small number of principle components (PCs). It is shown, with the aid of experimental data, that by simply
tracking changes in the directions of these PCs both inter-lot and intra-lot patterns can be identified.
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